TSMC to Produce Fingerprint Sensors for New iPhone at 12-Inch Fab?

TSMC will reportedly begin producing fingerprint sensors for the next iPhone at its 12-inch fab using a 65nm process in Q2 2014, reports DigiTimes.

In order to ensure the yield rates of the new fingerprint sensors, TSMC is also expected to handle the backend wafer level-chip scale packaging (WL-CSP) process in house, instead of subcontracting the packaging process to IC backend service firms as done previously, the sources revealed. TSMC has been fabricating the fingerprint sensors for iPhone 5s at its 8-inch fabs, while outsourcing the backend services to Xintec, China Wafer Level CSP and Advanced Semiconductor Engineering (ASE).

TSMC is also said to be beginning production of application processors for Apple soonusing a 20nm process.


More details at the link below...

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