Some of those components contain multiple die; the package-on-package (PoP) assembly, for example, contains the new Apple processor and the DRAM die. The NFC solution also contains the secure element as well as the NXP NFC controller and radio. So there are 30 individual components, and at least 30 pieces of silicon, all in a package that is only 26 mm x 28 mm. That is quite an accomplishment.
● The new Apple APL0778 application processor measures 5.2 mm x 6.2 mm and is fabbed on Samsung’s 28 nm LP process.
● Dialog has the PMIC socket for the watch, but Maxim got the codec and amplifier sockets. What happened to Cirrus? They had been the incumbent in iPhones and iPads for several generations.
● NXP scored the NFC and secure element and interface socket and Austria Micro Systems got the NFC signal booster
● STMicroelectronics not only grabbed the 6-axis sensor, but they also have an ST32 MCU within the S1, as well as the optical emitter/sensor encoder die under the shaft of the Digital Crown.
● Texas Instruments has 6 wins in the S1 ranging from battery management to opp amps.
● Skyworks Wi-Fi LNA + switch and PA
● [Below] you see a composite image of all the dies we have been able to identify so far.
ChipWorks also discovered that the Apple Watch features a STMicroelectronics 6 axis sensor for acceleration and roll, pitch and yaw (gyroscope).
Many more details can be found in the technical teardown linked below...