As pictured below, there is a difference in the die size for the APL0898 (Samsung) and the APL1022 (TSMC). From a benchmarking point of view, the smaller die size shows a leadership in technology scaling for Samsung. On the other hand, for Apple to go through all the trouble of dual-sourcing a custom designed part and launching on day one with both parts, suggests major sourcing problems.
Chipworks says its analysis is ongoing as they continue decapsulation and cross-sectioning to see who made what. We'll let you know as further details are revealed.
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