JCET Reportedly Lands Apple Orders for Assembly of SiP Modules in 2016

Jiangsu Changjiang Electronics Technology (JCET), the largest semiconductor packaging and test services provider in China, has landed assembly orders for SiP (system-in-package) modules from Apple for 2016, reports DigiTimes.

JCET will be a new contract provider of SiP assembly services for Apple, adding to the existing suppliers including Japan's Murata and Universal Scientific Industrial (USI) of Taiwan-based Advanced Semiconductor Engineering (ASE), according to industry sources. STATS ChipPAC, which was acquired by JCET earlier in 2015, already has its Korea-based operation obtain certification from Apple, said the sources.

Notably, JCET's board has approved a plan to spend $200 million to expand production lines for SiP modules. Currently, Apple uses a SiP design for the Apple Watch and there have been rumors that the company is looking to do the same for the iPhone.


Check out the components in the Apple S1 SiP for Apple Watch here.

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