Apple is apparently planning to apply the shielding to radio frequency (RF), connectivity (wireless LAN, Bluetooth), application processor (AP), modem, and other chips. The company previously utilized this technology for its PCB and connector but decided to expand its use as the clock signals of digital chips have increased.
When EMI Shield technology is applied, unexpected signals that happen due to electromagnetic interference can be prevented. Also circuit boards can also be assembled more elaborate. When mounting space between chips is decreased, areas that are left over can be used for batteries and eventually increase times that batteries can last. Major chips’ production costs will increase due to addition of new process.
StatsChipPac and Amkor will reportedly be responsible for the EMI Shield process on the iPhone 7. Both companies have factories located in South Korea.
Apple is widely expected to unveil the iPhone 7 this fall. While you wait, check out this concept that incorporates all its rumored features. You can also follow iClarified on Twitter, Facebook, Google+, or RSS for updates.