TSMC is also working with Apple on 10nm chip designs that will go into production later in 2017, said the sources. TSMC will also offer its backend integrated fan-out (InFO) wafer-level packaging (WLP) technology for Apple's 10nm A11 chips, the sources indicated.
Recent reports have suggested that Apple has selected TSMC as its exclusive manufacturing partner for the upcoming A10 and A11 processors cutting out Samsung.
The iPhone 7 which is expected to launch next month, will very likely be powered by a new A10 chip. Please follow iClarified on Twitter, Facebook, Google+, or RSS for updates.