The A11 processor is said to use TSMC's 10nm process.
TSMC with its 10nm process technology is believed to have obtained orders for Apple's A11 processor which will power the 2017 iPhones, said the sources. The Taiwan-based foundry will also offer its backend integrated fan-out (InFO) wafer-level packaging (WLP) technology for the 10nm A11 chips beating Amkor Technology and other backend specialists, the sources indicated.
Additionally, the company is said to have been contracted to make OLED driver ICs based designed in-house by Apple. Industry sources say that Apple is internally working on the development of touch and display driver integration (TDDI) single-chip solutions for its iPhones. Until now Synaptics has been the sole supplier of driver ICs for the iPhone.
Taiwan-based Chipbond and MPI have both entered Apple's supply chain by working with TSMC, the sources revealed. MPI provides probe cards for TSMC's wafer testing, while Chipbond will be engaged in the driver-IC backend services, the sources said.
Apple is rumored to be working on an all-glass iPhone with an edge-to-edge OLED display that has no bezels on the top and bottom. Additionally, the front camera, Touch ID, speaker, and other sensors will apparently be embedded into the display.
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