TSMC's second generation integrated fan-out (InFO) wafer-level packaging technology is said to bring more competitiveness to the foundy's 7nm FinFET process technology.
Samsung has grabbed Apple's A9 chip orders for the new 9.7-inch iPads introduced earlier in 2017, the observers claimed. TSMC, which is already the sole supplier of Apple's 10nm A11 chips for the upcoming iPhones, will still likely obtain all of the next-generation A-series chip orders for Apple's 2018 series of iPhones with its 7nm FinFET process, the observers said.
The innovation in backend packaging will be key in securing exclusive orders from Apple despite Samsung aggressively vying for orders as well.
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