Just before production kicked off, Apple requested modifications to the mask patterns prompting both contract chipmakers to rework wafers, said the sources. Nevertheless, the event should not interrupt the new iPhone launch schedule, the sources noted.
Notably, the site says TSMC won't start mass production of A9 chips on its 16nm FinFET process until the fourth quarter of 2015.
TSMC is also said to be contracted to manufacture fingerprint sensors and audio chips at its 12-inch fabs.
Previous reports suggested TSMC would use its 65nm fabrication process to supply fingerprint sensors for the next-generation iPhones expected in the fall of 2015. In addition, the foundry will reportedly manufacture iPhone chips for Cirrus Logic using 45/55nm process technologies.
Apple is said to have placed a record breaking initial order of 85-90 million next generation iPhones.
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