LCD smartphones that use a 0.4t LED chip for backlighting have a bottom bezel of 4.0-4.5mm. The 0.3t LED chips allows for a reduction of the bottom bezel to 2.0-2.5mm.
Packaging of 0.3t LED chips for side-view backlighting of LTPS-LCD smartphone panels is more difficult in accuracy and stability than that of 0.4t LED chips, the sources noted, adding Nichia began trial production of 0.3t LED chips for use in high-end smartphone models launched by China- and Japan-based vendors in the first half of 2018.
Sources say that Nichia's production capacity for 0.3t LED chips will be almost entirely taken up by Apple in the second half of 2018. Epistar and Sanan Optoelectronics are nearly ready to produce 0.3t LED chips while packaging service providers Everlight Electronics, Unity Opto Technology, Foshan Nationstar Optoelectronics, and Shenzhen Refound Optoelectronics are able to package 0.3t LED chips for side-view backlighting.
Apple is expected to unveil the rumored 6.1-inch LCD iPhone this fall alongside new 5.8-inch and 6.5-inch OLED iPhones.
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