TSMC is set to install production equipment at its 20nm facilities on April 20th, two months ahead of schedule, reports EDN via DigiTimes.
Following the equipment move-in, TSMC is expected to tape out SoC products at 20nm around the end of the second quarter with initial capacity of 5,000 12-inch wafer starts per month, the report cited unnamed fab tool suppliers as indicating. The new technology node is set to enter volume production in the third quarter with monthly capacity reaching more than 10,000 wafer starts, the report said.
It's been predicted that Apple may shift its production of the upcoming A7 processor to TSMC from Samsung to take advantage of the technology and reduce its reliance on Samsung.
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Following the equipment move-in, TSMC is expected to tape out SoC products at 20nm around the end of the second quarter with initial capacity of 5,000 12-inch wafer starts per month, the report cited unnamed fab tool suppliers as indicating. The new technology node is set to enter volume production in the third quarter with monthly capacity reaching more than 10,000 wafer starts, the report said.
It's been predicted that Apple may shift its production of the upcoming A7 processor to TSMC from Samsung to take advantage of the technology and reduce its reliance on Samsung.
Read More