Apple has been granted a patent for a 'Double-Sided Touch Sensitive Panel and Flex Circuit Bonding'. The patent was filed September 16, 2011 and granted May 21, 2013. It details a panel with column and row traces on both sides of the substrate. This results in a reduced overall size for the sensor panel and may help Apple reduce the size of its future devices.
A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side of the substrate using a novel fabrication process. Traces made of copper or other highly conductive metals running along the edge of the substrate can be used to bring the row traces to the same edge of the substrate as the column traces so that flex circuits can be bonded to the same edge of the substrate on directly opposing sides of the substrate, minimizing the area needed for connectivity and reducing the overall size of the sensor panel.
More information can be found at the link below...
Read More [via AppleInsider]
A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side of the substrate using a novel fabrication process. Traces made of copper or other highly conductive metals running along the edge of the substrate can be used to bring the row traces to the same edge of the substrate as the column traces so that flex circuits can be bonded to the same edge of the substrate on directly opposing sides of the substrate, minimizing the area needed for connectivity and reducing the overall size of the sensor panel.
More information can be found at the link below...
Read More [via AppleInsider]