Apple is working on adopting faster and smaller circuit boards for next year's MacBook and Apple Watch, according to KGI Securities analyst Ming-Chi Kuo.
The iPhone 8 and iPhone X already use a new flexible circuit board (FPCB) made from liquid crystal polymer (LCP) in their antenna designs. The iPhone X also uses LCP for its TrueDepth camera. This technology allows for high speed and low latency data transfer while also saving space.
Kuo says Apple is working with Career on integrating the technology into its notebook lineup.
It order to address future hardware form factor design requirements (e.g. saving more internal space) and to keep abreast of potential data transmission spec upgrades (e.g. USB 3.2), we believe Apple is now working with Career, its FPCB supplier for MacBook, in exploring LCP FPCB designs for future MacBook models
The company is also said to be working with Career on new LCP antenna designs for the Apple Watch.
"LCP FPCB production presents a greater challenge compared to PI, as the former needs to be more particular as regards material stability, higher-temperature process, impedance control and higher standards of etching process," says Kuo.
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[via 9to5Mac] [via AppleInsider]
The iPhone 8 and iPhone X already use a new flexible circuit board (FPCB) made from liquid crystal polymer (LCP) in their antenna designs. The iPhone X also uses LCP for its TrueDepth camera. This technology allows for high speed and low latency data transfer while also saving space.
Kuo says Apple is working with Career on integrating the technology into its notebook lineup.
It order to address future hardware form factor design requirements (e.g. saving more internal space) and to keep abreast of potential data transmission spec upgrades (e.g. USB 3.2), we believe Apple is now working with Career, its FPCB supplier for MacBook, in exploring LCP FPCB designs for future MacBook models
The company is also said to be working with Career on new LCP antenna designs for the Apple Watch.
"LCP FPCB production presents a greater challenge compared to PI, as the former needs to be more particular as regards material stability, higher-temperature process, impedance control and higher standards of etching process," says Kuo.
Please follow iClarified on Twitter, Facebook, or RSS for updates.
[via 9to5Mac] [via AppleInsider]