The A11 chips, which will power the upcoming iPhone series slated for launch in September 2017, will be built on a 10 nm FinFET process and packed with a wafer-level integrated fan-out (InFO) packaging technology, said the report.
TSMC is expected to be able to produce 100 million A11 chips before the end of the year.
It's widely expected that the 10th anniversary iPhone will be a massive update. It will purportedly have a chassis made of reinforced glass with a stainless steel metal frame and an edge-to-edge display that has no bezels on the top and bottom. Additionally, the front camera, Touch ID, speaker, and other sensors will apparently be embedded into the display. Another report claims that the device would be a clear piece of glass with a next-generation OLED screen. The 5.8-inch screen is said to feature a main 5.15-inch display area with a reserved 'function area' below for virtual buttons. The device may use a stacked logic board design freeing up space for a larger battery pack. More recently, Apple is said to be equipping the phone with wireless charging, an iris scanner or face scanner, and a 3D camera.
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