Upstream to downstream suppliers in the iPhone supply chains, including Taiwan Semiconductor Manufacturing Company (TSMC), SLP (substrate-like PCB) makers Zhen Ding Technology and Kinsus Interconnect Technology, and battery supplier Simplo Technology, are ready to ramp up related iPhone parts starting June, said the report.
TSMC is expected to begin fabrication of the wafers needed for the A11 processor on June 10 and deliver chips in volume quantity in the second half of July. Zhen Ding and Kinsus have improved yield rates of SLP products in time for volume production in June. Additionally, assemblers Foxconn Electronics, Winstron and Pegatron are accelerating recruitment and training efforts ahead of mass production.
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