"This is how I think the next iPhone generation should look like", says Reis. "Thinner display bezels, yet a body with fillets surrounding the device, allowing for a better grip. The body itself is now only 6mm thick and is also flatter than the iPhone 6/6s. No 3.5mm headphone jack, no camera bump, Force touch on the Home Button with Taptic Engine, water resistance."
Apple is expected to unveil the iPhone 7 this fall. TSMC is rumored to be the exclusive manufacturer of its new A10 chip. Take a look at the photos and video below and let us know what you think in the comments.
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