Chipworks Posts Teardown of the New 4-inch iPhone SE [Photos]

Chipworks has posted the first teardown of the new 4-inch iPhone SE. Their teardown reveals a mix of components from the iPhone 5s, iPhone 6, and iPhone 6s.

While there is still much to discover about this new iPhone, what is becoming clear is that this is not your typical Apple release. There are very few new parts, but that hardly means there is no innovation. As is the genius of Apple and its fearless leader, Mr. Cook, it is the combination of all the right parts that make a successful product. Finding that just-right balance of old and new, and at such a low cost, is no easy feat.

Highlights:
● A9 appears to be the same as found in the iPhone 6s. APL1022 part number
● SK Hynix memory, likely the same 2 GB LPDDR4 mobile DRAM found in the iPhone 6s
● Broadcom BCM5976 and Texas Instruments 343S0645 that were also used back in the iPhone 5s
● Driving the NFC is the NXP 66V10. The 66V10 contains two die, the Secure Element 008 and the NXP PN549
● 6-axis inertial sensor (x, y, z, roll, pitch, and yaw) is an InvenSense 6-axis sensor
● A throwback to the iPhone 6/6 Plus is the Qualcomm MDM9625M modem and the WTR1625L RF transceiver
● Audio ICs are still the same 338S00105 and 338S1285 devices used in the iPhone 6s
● New Texas Instruments 338S00170 power management IC.
● Skyworks SKY77611 power amplifier module
● Toshiba THGBX5G7D2KLDXG NAND flash
● EPCOS D5255 antenna switch module
● AAC Technologies 0DALM1 microphone


Check out some images below or hit the link for the full teardown.

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