Next Generation AirPods May Adopt System in Package (SiP) Technology [Report]

Apple's next generation AirPods, rumored to arrive as early as late 2019, may feature a new internal design, reports DigiTimes.

AirPods 3 - reportedly to hit the market by the end of 2019 - may feature a brand-new internal design adopting SiP (system in package) technology instead of rigid-flex board combination, the sources said.


A system in package design integrates a number of circuits in a single chip package, potentially saving space and reducing complexity.

It's rumored that Apple is planning to launch two new AirPods in 4Q19 at the earliest. One is said to have an all-new form factor design at a higher price and could feature noise cancellation capabilities.

The use of SiP technology may allow Apple to fit AirPods with a bigger battery, offsetting the high power consumption of a noise cancellation feature.

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