Apple's A19 Chip Revealed in First Detailed Die Shot [Images]

The first high-resolution die shots of Apple's new A19 chip have been published by semiconductor analysis firm Chipwise, offering a detailed look inside the silicon powering the latest iPhone. The standard A19, found in the new iPhone 17, is captured here, revealing the intricate layout that drives Apple's next-generation performance.

According to Chipwise, the A19 is built on TSMC's third-generation 3-nanometer process, known as N3P. This refinement of the N3E node used for last year's A18 series brings modest gains in transistor density and energy efficiency. The images highlight key design elements, including hybrid CPU cores, cache banks, the Neural Engine, and Apple's image signal processor.

While the standard A19 powers the base iPhone 17, the more advanced A19 Pro appears in the iPhone Air and iPhone 17 Pro. Chipwise reports that the Pro version includes additional GPU cores, while Apple says the A19 Pro adds neural accelerators to each GPU core, boosting AI performance. In a recent interview, Apple executives described the chip as delivering "MacBook Pro class performance" for AI workloads. Early benchmarks suggest the A19 Pro outpaces last year's A18 Pro by more than 13%.


Chipwise also notes enhancements to supporting hardware such as the display engine and ISP, which are critical to enabling the new camera system and improving power management across the A19 lineup.

Taken together, the die shots not only visualize the physical layout—logic blocks, cache banks, interconnects—but also reflect Apple's continuous push in process technology and architectural refinement.

Check out the images below and please download the iClarified app or follow iClarified on Twitter, Facebook, YouTube, and RSS for more Apple news and updates.



[Backside view of Apple's A19 SoC]



[Frontside view of Apple's A19 Chip]