DigiTimes has published a detailed list of component suppliers for the new iPhone expected in June.
TSMC have landed foundry orders for GSM EDGE power amplifiers, Bluetooth ICs and 3.2-megapixel OmniVision CMOS image sensor (CIS) used in the upcoming iPhone model, indicated the sources. Xintec will handle the packaging and testing service for the CIS whereas VisEra will manufacture on-chip color filters for the CIS.
You can see the complete breakdown in the chart below...
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