Samsung to Supply Apple With FC-BGA for M2 Chip [Report]

Samsung has been developing a flip chip ball grid array (FC-BGA) that it will supply to Apple for the upcoming M2 chip, reports ETNews. FC-BGA is a semiconductor substrate that connects a chip to the main substrate.

Samsung Electro-Mechanics initially supplied FC-BGA substrates for the M1, receiving "high scores" for its high-spec substrate. Consequently, it landed orders to supply the component for the M2.

According to the site, there is only handful of companies that can reliably supply FC-BGA to Apple, despite Taiwan and Japan investing trillions in the technology. Japan's Ibiden and Taiwan's Unimicron are other potential suppliers.


Samsung Electro-Mechanics has been expanding its high value-added substrate business in an aggressive manner. It is expanding investment and focusing on securing customers as a supply shortage is expected by 2027. Samsung Electro-Mechanics invested KRW 1.3 trillion in package substrate production facilities in its Vietnamese production subsidiary at the end of last year, and it invested additional KRW 300 billion in the FC-BGA substrate last month.

Apple is purportedly testing at least nine new Mac models with four different M2-based chips. The company could unveil some of these devices this year, perhaps at WWDC 2022.

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