Apple Will Not Use RCC for 2024 iPhone 16 [Kuo]

Apple will not use resin coated copper (RCC) foil for the logic board on the next generation iPhone 16, according to a new report from TF International Securities analyst Ming-Chi Kuo.

In a post on Medium today, Kuo says...

RCC can reduce the thickness of the mainboard (i.e., it can save internal space) and make the drilling process easier because it's fiberglass-free. However, RCC will not be adopted in the 2024 iPhone 16 due to its fragile characteristics and inability to pass drop tests.


Kuo suggests that if Apple and Ajinomoto are able to improve the characteristics of RCC it will be used in the iPhone 17.

Currently, Ajinomoto is the leading supplier of RCC material. If Apple and Ajinomoto can improve the RCC material before 3Q24, the 2025 new high-end iPhone 17 models will use it.

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