TSMC Announces Additional $100 Billion Investment in Arizona Chip Facilities

The Trump administration on Thursday announced that Taiwan Semiconductor Manufacturing Company (TSMC) will invest an additional $100 billion to expand its advanced semiconductor manufacturing and packaging operations in Arizona.



The new commitment brings TSMC's total planned investment in the United States to a record $265 billion. The Department of Commerce said the expansion will add four advanced semiconductor facilities, bringing TSMC's U.S. footprint to 12 leading-edge manufacturing and packaging sites. TSMC Chairman and CEO Dr. C.C. Wei was less definitive during the company's earnings call, saying the investment would probably result in four additional front-end and back-end facilities.


The expansion follows an earlier investment announced in March 2025, when TSMC increased its planned U.S. spending from $65 billion to $165 billion.

For Apple, the expansion strengthens access to domestic semiconductor manufacturing capacity. As TSMC's largest customer, Apple relies on the foundry's advanced process technologies for chips used across the iPhone, iPad, Mac, and other products. The company is already sourcing 100 million American-made chips from TSMC's Arizona campus this year.

The Department of Commerce said the additional investment follows the trade and investment agreement signed between the United States and Taiwan in January 2026. The agreement is intended to encourage investment by Taiwanese semiconductor companies and expand the U.S. chip supply chain.

Wei said the investment will support strong multi-year demand from TSMC's leading U.S. customers. He added that construction timing will depend on market conditions and customer demand, although the company plans to move as quickly as possible. Commerce Secretary Howard Lutnick said the expansion is expected to create tens of thousands of American jobs.