Samsung has announced a 64GB moviNAND chip which could possibly be used in the next generation iPhone.
The 64GB moviNAND, which measures 1.4mm in height, consists of 16 30nm-class 32Gb MLC NAND chips and a controller. The 17-die stack was achieved by using 30-micron thick chips and advanced package technology. With the new 64GB solution, Samsung's proprietary embedded memory, moviNAND, is now available in 64GB, 32GB, 16GB, 8GB and 4GB densities.
Apple has doubled the maximum capacity of the iPhone with a new release every summer; thus, the 4G iPhone is likely to see an increase to 64GB in storage.
Toshiba has already announced their 64GB embedded NAND flash memory module so Apple will have more then one choice in suppliers.
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The 64GB moviNAND, which measures 1.4mm in height, consists of 16 30nm-class 32Gb MLC NAND chips and a controller. The 17-die stack was achieved by using 30-micron thick chips and advanced package technology. With the new 64GB solution, Samsung's proprietary embedded memory, moviNAND, is now available in 64GB, 32GB, 16GB, 8GB and 4GB densities.
Apple has doubled the maximum capacity of the iPhone with a new release every summer; thus, the 4G iPhone is likely to see an increase to 64GB in storage.
Toshiba has already announced their 64GB embedded NAND flash memory module so Apple will have more then one choice in suppliers.
Read More