June 29, 2026
Leaked iPhone 18 Pro Motherboard Reveals A20 Pro Packaging Redesign

Leaked iPhone 18 Pro Motherboard Reveals A20 Pro Packaging Redesign

Posted 1 hour ago by
Leaked images of an alleged iPhone 18 Pro motherboard have surfaced online, alongside claims that Apple's upcoming A20 Pro chip will adopt a new packaging design aimed at improving sustained on-device AI performance.

Leaked iPhone 18 Pro Motherboard Reveals A20 Pro Packaging Redesign

Details shared on X by Reptalicant and further analyzed by Ice Universe indicate the A20 Pro will adopt Wafer-Level Multi-Chip Module (WMCM) packaging. The leaked motherboard image appears to show the large package area that houses the A20 Pro and its surrounding connections. According to the leakers, the revised layout reflects Apple's transition away from traditional package-on-package (PoP) packaging, moving the DRAM to the side of the compute package rather than stacking it directly above the processor. The new arrangement is expected to create a clearer thermal path by reducing heat concentration around the CPU, GPU, and NPU, potentially allowing the chip to sustain peak performance for longer before thermal throttling.


The leak also points to the integration of LPDDR6 memory utilizing a 96-bit bus. While the bus width itself is relatively standard, upgrading to the LPDDR6 specification is expected to deliver significantly higher bandwidth and better overall energy efficiency. Faster memory access is critical for supplying data to the processor during complex, on-device workloads. The reported memory configuration also aligns with recent supply chain intelligence suggesting Apple plans to stick with 12GB of RAM for the iPhone 18 Pro lineup while upgrading to faster LPDDR6 memory. If accurate, the move would prioritize bandwidth and efficiency improvements over additional capacity.

Despite these architectural shifts, the total die size of the 2-nanometer A20 Pro is said to remain roughly identical to the current A19 Pro. If the leak is accurate, Apple appears to be reallocating resources within the existing chip dimensions rather than expanding the physical silicon footprint to accommodate more transistors.

The most prominent reported change is a noticeably expanded Neural Processing Unit. A larger NPU would suggest Apple is placing greater emphasis on local compute power to support the next-generation Apple Intelligence features rolling out across the ecosystem. A more capable neural engine could better handle demanding generative workloads locally, including instant language translation, semantic photo searches, advanced Siri reasoning, and other AI-powered tasks without relying as heavily on cloud servers.

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