Apple's iPhone 18 Pro to Feature In-House C2 Modem and 2nm A20 Chip [Report]

Apple's iPhone 18 Pro models will reportedly debut the company's second-generation in-house modem, the C2, alongside an A20 processor built on TSMC's 2-nanometer process. The report, published by the Commercial Times in Taiwan, also suggests that future M6 Mac chips and R2 Vision Pro processors will adopt the new 2nm node.

The shift is part of Apple's strategy to reduce reliance on external suppliers and build a fully self-sufficient chip ecosystem. According to the report, the iPhone 18 Pro, expected in fall 2026, will use the A20 chip with advanced WMCM packaging — aligning with a previous forecast on the new packaging technology. That same timeline is also when Apple is expected to debut its first foldable iPhone, which is likewise said to feature the C2 modem.

The 2nm process is expected to extend to other product lines, including the M6 chip for a redesigned MacBook Pro and a new R2 chip for the Vision Pro. This vertical integration allows Apple greater control over performance, power consumption, and production costs.


TSMC is reportedly ramping up its 2nm capacity to meet demand, with plans to reach 40,000 to 50,000 wafers per month by the end of 2025 and nearly 100,000 per month in 2026. This follows an earlier report that Apple had secured nearly half of the initial 2nm output. Built on a GAA transistor design, the node is expected to deliver better cost efficiency than 3nm and has attracted strong customer interest.

Apple's push toward chip self-sufficiency builds on more than a decade of in-house silicon development. The company first introduced its A-series processors in 2010, expanded to Macs with the launch of the M1 in 2020, and is now moving to integrate critical modem and connectivity chips. Analysts say this vertical integration could further differentiate Apple's products from competitors while reducing long-term costs.

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