Apple's high-end iPhone models could look far more uniform in 2026. A new research note from GF Securities analyst Jeff Pu, seen by iClarified, suggests the iPhone 18 Pro, Pro Max, and Fold will all share the same A20 Pro chip, 12GB of RAM, and Apple's C2 baseband modem.
The entire high-end lineup, including the new foldable, is expected to be powered by the A20 Pro chip. It will reportedly be built on TSMC's next-generation 2-nanometer (N2) process and use WMCM (Wafer-Level Multi-Chip Module) packaging. To support advanced on-device AI, Apple is said to be standardizing memory at 12GB of LPDDR5 across the Pro models and the Fold.
The note also suggests Apple will expand its in-house modem rollout in 2026. All three premium models are listed with the Apple C2 baseband chip, marking a further step away from Qualcomm. This aligns with previous reports that Apple's second-generation modem would be ready for the 2026 cycle.
Camera changes are expected on the Pro models. The iPhone 18 Pro (6.3-inch) and Pro Max (6.9-inch) are expected to feature a 48MP main camera with a variable aperture (VA), offering more control over depth of field and low-light performance. They are also listed with a 48MP periscope telephoto lens, a 48MP ultra-wide camera, and an 18MP front-facing camera.
Pu also expects Apple to further refine the front-facing design on its Pro models. The report points to a smaller Dynamic Island in 2026, while noting a low likelihood that Apple will move to under-display Face ID during this product cycle.
For the iPhone 18 Fold, Pu outlines a device with a 7.8-inch internal display and a cover screen smaller than 5.3 inches. The chart suggests the Fold will skip Face ID in favor of Touch ID, likely integrated into a side button to preserve a slim profile. The chassis is described as a combination of titanium and aluminum.
While the focus is on next year's hardware, Pu also shared updated insights into Apple's near-term production outlook. Driven by resilient demand for the iPhone 17, the firm has raised its build estimates for the first quarter of 2026 from 56 million to 59 million units. Pu also trimmed his forecast for global smartphone shipments, now expecting roughly a 6 percent year-over-year decline in 2026. He cites sharply rising LPDDR and NAND costs as a key pressure point, noting that memory now accounts for as much as 20 to 30 percent of a smartphone's bill of materials. While this is forcing specification cuts in some mid- and low-end Android models, Pu expects Apple to continue outperforming thanks to its procurement leverage and supplier negotiations, with IDC data showing Apple gaining share even as the broader market contracts.